Intel has launched its next generation low-power data center chip family which is known as Xeon D. According to Intel, Xeon is offering 1.7 times the performance per watt of its prior generation. Initial four and eight core products are available for micro-server workloads with some additional products which are optimized for network storage coming in the second half of 2015. These parts are used to integrate between four and eight Broadwell CPU cores, 2 x 10 GB Ethernet controllers and 24 lanes of PCI Express 3.0 connectivity built in Intel’s 14-nanometer technology. On the second chip Intel includes Serial ATA 3.0, USB 3.0 and USB. These initial products will be important for dedicated web hosting, dynamic web serving and memory caching. They have more specialized workloads that will be able to do more functions like entry level storage area networks, wireless base stations and edge routers.
Xeon D: a competitive technology
Xeon dedicated servers are designed for customers who has less complex computing requirement. It helps those customers who want average server load. Xeon is basically for e-commerce, database and enterprise applications. The price depends on the users’ requirements. Subscription period generally from 3 to 12 months which is according to the requirement. It can be renewed or changed by user. These servers provide fast speed and great performances at special prices. It offers Tyan Motherboard, 1024 Megabytes, 1000 GB of Transfer Inbound and Outbound both, 80 GB SATA Hard Drive. Intel told that more than 50 systems are currently designed which are based on new Xeon D processors. Company has a part whose codename is Denverton that would be built on company’s 14-nanometer process on a newer Atom core.
Xeon D as a Cloud future:
Intel has launched product which is Atom based named Avoton processors to encounter threat. This product is available at very low cost and it is for lower applications.
The Xeon D adopted latest technology from Intel into a single package which is designed for blade servers and other dense configurations with a single processor based on every computing node. The product which has made is not a single chip but it is a two pieces of silicon sharing called as common package. The package itself contains everything which is necessary for a complete server node. Company has planned to produce 50 billion devices by 2020 which will be power efficient servers that can be used to deliver information quickly.